Today, ACC’s niche is high-grade sweeps and hazardous waste streams but our roots are deeply entwined in electroplating chemistries. In the 1920’s family patriarch Joseph A. Smith invented the first heavy gold electroplating process. In 1954, Paul T. Smith invented and patented a Non-Cyanide Gold bath known today as Sulfite Gold. Those traditions continue to this day. See below for our product offerings. For Pricing, Tech Data & SDS sheets or to place an order: email - products@advchem.com
FEATURED PRODUCT
ContrAul Gold Stripper II
Specially formulated to strip gold from base metal substrates quickly and easily.
- shipped as a liquid concentrate
- simply add water and Potassium Cyanide to make up final stripping solution
- will not attack nickel, kovar, stainless steel, or steel
- easily operates at room temperature;
- increasing the temperature will substantially increase stripping rate
- eliminates crystallization of gold salts and reduces drag-out losses
- gold remains in solution, allowing for an accurate assay on the gold metal contained
- strip solution can be sent to ACC for refining and disposal
- gold can be plated out from solution onto cathodes and captured through filters & resins
- solution, plate-outs, fitters and resins can be sent to ACC for refining
- shipping options include 5-gallon plastic containers or 55-gallon drums
Call or email for pricing, tech data sheets & SDS - email products@advchem.com
ContrAul Gold Stripper II Brochure
PRECIOUS METAL ELECTROPLATING PROCESSES
| PRODUCT NAME | BENEFITS AND FEATURES |
|---|---|
|
HYTECH C
|
Mildly acidic cobalt hardened gold. Used for rack and barrel plating for industrial applications. Meets ASTM B488 and Mil-G-45204C. |
|
HYTECH N
|
Mildly acidic nickel hardened gold. Used for rack and barrel plating for industrial applications. Meets ASTM B488 and Mil-G-45204C. |
|
GOLDSPEC C
|
Mildly acidic high-speed cobalt hardened gold process. Exceptional throwing power. Meets ASTM B488 and Mil-G-45204C |
|
GOLDSPEC N
|
Mildly acidic high-speed nickel hardened gold process. Exceptional throwing power. Meets ASTM B488 and Mil-G-45204C. |
|
GOLD N WEAR C
|
Mildly acidic cobalt brightened gold process for decorative applications |
|
GOLD N WEAR N
|
Mildly acidic nickel brightened gold process for decorative applications |
|
GOLD N WEAR III
|
Acidic nickel or cobalt brightened decorative gold process. Plates directly over stainless steel and can be color matched in varying gold shades. Recommended for parts requiring a ductile and flexible deposit. |
|
HYFLEX
|
Acidic nickel or cobalt hardened. Plates heavy very ductile thickness directly over difficult-to-activate metals such as stainless steel. Meets ASTM B488 and Mil-G-45204C. |
|
10 Oz Silver Bar
|
Our Ten Ounce Silver Bars are 99.9+ percent Silver. They are minted in Rhode Island and are accompanied by a Certificate of Authenticity. Each bar is also numbered with a unique Serial Number. A special black velvet gift bag can be purchased separately. Price breaks are available. Please call 800-553-3568 or email Info@advchem.com for price inquiries or to place an order. |
| PURE GOLDS | BENEFITS AND FEATURES |
|---|---|
|
HYTECH 918
|
Neutral gold process for Rack Plating only, with excellent throwing power. Eliminates arsenic or thallium as grain refiners. Meets ASTM B488 and Mil spec 45024C. |
|
HYTECH P
|
Neutral gold process formulated specifically for printed circuit boards. Excellent solderability. Meets ASTM B488 and Mil spec 45024C. |
|
HYFLEX
|
Acidic nickel or cobalt hardened. Plates heavy very ductile thickness directly over difficult-to-activate metals such as stainless steel. Meets ASTM B488 and Mil-G-45204C. |
| GOLD STRIKE | BENEFITS AND FEATURES |
|---|---|
|
HYTECH GOLD STRIKE
|
Pure gold strike process for flash deposits. Used prior to subsequent gold plating processes. |
|
HYFLEX
|
Acidic nickel or cobalt hardened. Plates heavy very ductile thickness directly over difficult-to-activate metals such as stainless steel. Meets ASTM B488 and Mil-G-45204C. |
| DECORATIVE/COLOR GOLDS | BENEFITS AND FEATURES |
|---|---|
|
PERM AU TONE I
|
Decorative gold flash for decorative purposes. Can be formulated for any gold shade such as; Hamilton, rose, pink, green, smut etc. |
|
PERM AU TONE II
|
Decorative gold flash for decorative purposes. Can be formulated for any gold shade such as; Hamilton, rose, pink, green, smut etc. Used when thicker gold deposits are required. |
| PALLADIUM, SILVER, & RHODIUM | BENEFITS AND FEATURES |
|---|---|
|
SILVERTONE
|
Decorative white deposit for thin layer applications. |
|
NOBELITE BRIGHT RHODIUM
|
Decorative brilliant white deposit. |
| BRUSH PLATING | BENEFITS AND FEATURES |
|---|---|
|
SILVERTONE BRUSH
|
Decorative silver brush applications. Bright white deposit. |
|
AC RHODIUM BRUSH
|
Decorative rhodium brush applications. Bright white deposits. |
|
GOLD N WEAR C BRUSH
|
Cobalt brightened/hardened gold brush applications. |
|
GOLD N WEAR N BRUSH
|
Nickel brightened/hardened gold brush applications. |
|
HYFLEX BRUSH
|
High acid gold brush plating applications for difficult to plate substrates. |
NON-PRECIOUS METAL ELECTROPLATING PROCESSES
| PRODUCT NAME | BENEFITS AND FEATURES |
|---|---|
|
BBX-II BRONZE |
Decorative alkaline bronze process. Brilliant yellow deposits have good leveling capability and build brightness to any practical thickness. Excellent diffusion barrier for non-nickel applications. |
| PERMAWHITE | Decorative imitation rhodium plating process. Bright white deposits. |
PLATEOUT/FILTER PRODUCTS (GOLD BUGS/RESINS)
| PRODUCT NAME | BENEFITS AND FEATURES |
|---|---|
|
GOLD FIRE DIP |
Alkaline cyanide solution for removal of superficial karat gold oxide films. Replaces costly and dangerous peroxide/cyanide ‘bomb’ dips. |
| SILVER FIRE DIP | Alkaline cyanide solution for removal of superficial pure and sterling silver films. |
| GOLD RECLAIM RESIN | Ion-exchange resin for the removal of trivalent gold acid waste streams/drag-outs. |
| GOLD RECLAIM RESIN AF | Strong basic ion-exchange resin for the removal of gold from a wide pH spectrum. Formulated to minimize the generation of fungus and bacterial growth. |
| PALLADIUM RESIN - ACID | Ion-exchange resin for the removal of palladium from mildly acidic waste streams/drag-outs. |
| SILVER RECLAIM RESIN | Ion-exchange resin for the removal of silver from waste streams/drag-outs. |
| GOLD STRIP DB BLEND | Dry salt gold strip formulation (1 part concentrate to 9 parts water). Includes Potassium cyanide. Minimal attack on nickel, copper and brass alloys. |
| CONTRAUL GOLD STRIPPER II | Concentrated gold strip formulation. Potassium cyanide not included. |
| DMG NICKEL TEST KIT | All inclusive test kit used for semi-quantitative analysis of nickel presence in nickel-free jewelry applications. |
| ANTI-TARNISH | Chromate anti-tarnish process. Can be used electrolytically and/or immersion. |
| DURAWEAR | Chromate-free immersion anti-tarnish process. Can be regenerated with replenisher chemistry. |
| CHEMPOL CB | Blend of dry acid activating salts formulated to remove tenacious films and oxides from copper and copper alloys. |
| TINOX | Antiquing process for gold deposits |
| NICKEL REDUCER FOR GOLD | Precipitates nickel ions from acid gold plating solutions. |
| NICKEL REDUCER FOR RHODIUM | Precipitates nickel ions from rhodium plating solutions. |
| ACTIUM I | Non-cyanide nickel activator. |
| GOLD BUG CATHODE | Cathodic target used to electrolytically remove gold ions from drag-outs. |
AFFILIATIONS
