Please note: We will be partially shut down from July 3-7, 2017.

  • Electroplating

    A variety of electroplating products.

Today, ACC’s niche is high-grade sweeps and hazardous waste streams but our roots are deeply entwined in electroplating chemistries.  In the 1920’s family patriarch Joseph A. Smith invented the first heavy gold electroplating process.  In 1954, Paul T. Smith invented and patented a Non-Cyanide Gold bath known today as Sulfite Gold.  Those traditions continue to this day.  See below for our product offerings.  For Pricing, Tech Data & SDS sheets or to place an order:  email  - products@advchem.com

FEATURED PRODUCT

ContrAul Gold Stripper II

Specially formulated to strip gold from base metal substrates quickly and easily.

  • shipped as a liquid concentrate
  • simply add water and Potassium Cyanide to make up final stripping solution
  • will not attack nickel, kovar, stainless steel, or steel
  • easily operates at room temperature;
  • increasing the temperature will substantially increase stripping rate
  • eliminates crystallization of gold salts and reduces drag-out losses
  • gold remains in solution, allowing for an accurate assay on the gold metal contained
  • strip solution can be sent to ACC for refining and disposal
  • gold can be plated out from solution onto cathodes and captured through filters & resins
  • solution, plate-outs, fitters and resins can be sent to ACC for refining
  • shipping options include 5-gallon plastic containers or 55-gallon drums

Call or email for pricing, tech data sheets & SDS  - email  products@advchem.com

ContrAul Gold Stripper II Brochure

 

PRECIOUS METAL ELECTROPLATING PROCESSES

PRODUCT NAME BENEFITS AND FEATURES
HYTECH C
Mildly acidic cobalt hardened gold. Used for rack and barrel plating for industrial applications.  Meets ASTM B488 and Mil-G-45204C.
HYTECH N
 Mildly acidic nickel hardened gold. Used for rack and barrel plating for industrial applications.  Meets ASTM B488 and Mil-G-45204C.
GOLDSPEC C
Mildly acidic high-speed cobalt hardened gold process. Exceptional throwing power.  Meets ASTM B488 and Mil-G-45204C
GOLDSPEC N
Mildly acidic high-speed nickel hardened gold process. Exceptional throwing power.   Meets ASTM B488 and Mil-G-45204C.
GOLD N WEAR C
 Mildly acidic cobalt brightened gold process for decorative applications
GOLD N WEAR N
 Mildly acidic nickel brightened gold process for decorative applications
GOLD N WEAR III
Acidic nickel or cobalt brightened decorative gold process.  Plates directly over stainless steel and can be color matched in varying gold shades.  Recommended for parts requiring a ductile and flexible deposit.
 
HYFLEX
 Acidic nickel or cobalt hardened.  Plates heavy very ductile thickness directly over difficult-to-activate metals such as stainless steel. Meets ASTM B488 and Mil-G-45204C.
 
10 Oz Silver Bar
Our Ten Ounce Silver Bars are 99.9+ percent Silver.  They are minted in Rhode Island and are accompanied by a Certificate of Authenticity.  Each bar is also numbered with a unique Serial Number.  A special black velvet gift bag can be purchased separately.  Price breaks are available.  Please call 800-553-3568 or email Info@advchem.com for price inquiries or to place an order.
PURE GOLDSBENEFITS AND FEATURES
HYTECH 918
Neutral gold process for Rack Plating only, with excellent throwing power.  Eliminates arsenic or thallium as grain refiners.  Meets ASTM B488 and Mil spec 45024C.
HYTECH P
Neutral gold process formulated specifically for printed circuit boards.  Excellent solderability.   Meets ASTM B488 and Mil spec 45024C.
 
HYFLEX
Acidic nickel or cobalt hardened.  Plates heavy very ductile thickness directly over difficult-to-activate metals such as stainless steel. Meets ASTM B488 and Mil-G-45204C.
GOLD STRIKEBENEFITS AND FEATURES
HYTECH GOLD STRIKE
Pure gold strike process for flash deposits.  Used prior to subsequent gold plating processes.
 
HYFLEX
Acidic nickel or cobalt hardened.  Plates heavy very ductile thickness directly over difficult-to-activate metals such as stainless steel. Meets ASTM B488 and Mil-G-45204C.
DECORATIVE/COLOR GOLDSBENEFITS AND FEATURES
PERM AU TONE I
Decorative gold flash for decorative purposes.  Can be formulated for any gold shade such as; Hamilton, rose, pink, green, smut etc.
 
PERM AU TONE II
Decorative gold flash for decorative purposes.  Can be formulated for any gold shade such as; Hamilton, rose, pink, green, smut etc.  Used when thicker gold deposits are required.
PALLADIUM, SILVER, & RHODIUMBENEFITS AND FEATURES
SILVERTONE
Decorative white deposit for thin layer applications.
 
NOBELITE BRIGHT RHODIUM
Decorative brilliant white deposit.
BRUSH PLATINGBENEFITS AND FEATURES
SILVERTONE BRUSH
Decorative silver brush applications. Bright white deposit.
 
AC RHODIUM BRUSH
Decorative rhodium brush applications. Bright white deposits.
GOLD N WEAR C BRUSH
Cobalt brightened/hardened gold brush applications.
GOLD N WEAR N BRUSH
Nickel brightened/hardened gold brush applications.
HYFLEX BRUSH
High acid gold brush plating applications for difficult to plate substrates.

NON-PRECIOUS METAL ELECTROPLATING PROCESSES

PRODUCT NAME BENEFITS AND FEATURES

BBX-II BRONZE

Decorative alkaline bronze process. Brilliant yellow deposits have good leveling capability and build brightness to any practical thickness. Excellent diffusion barrier for non-nickel applications.
PERMAWHITE Decorative imitation rhodium plating process. Bright white deposits.

PLATEOUT/FILTER PRODUCTS (GOLD BUGS/RESINS)

PRODUCT NAME BENEFITS AND FEATURES

GOLD FIRE DIP

Alkaline cyanide solution for removal of superficial karat gold oxide films.  Replaces costly and dangerous peroxide/cyanide ‘bomb’ dips.
SILVER FIRE DIP Alkaline cyanide solution for removal of superficial pure and sterling silver films.
GOLD RECLAIM RESIN Ion-exchange resin for the removal of trivalent gold acid waste streams/drag-outs.
GOLD RECLAIM RESIN AF  Strong basic ion-exchange resin for the removal of gold from a wide pH spectrum.  Formulated to minimize the generation of fungus and bacterial growth.
PALLADIUM RESIN - ACID Ion-exchange resin for the removal of palladium from mildly acidic waste streams/drag-outs.
SILVER RECLAIM RESIN Ion-exchange resin for the removal of silver from waste streams/drag-outs.
GOLD STRIP DB BLEND Dry salt gold strip formulation (1 part concentrate to 9 parts water). Includes Potassium cyanide. Minimal attack on nickel, copper and brass alloys.
CONTRAUL GOLD STRIPPER II Concentrated gold strip formulation. Potassium cyanide not included.
DMG NICKEL TEST KIT All inclusive test kit used for semi-quantitative analysis of nickel presence in nickel-free jewelry applications.
ANTI-TARNISH Chromate anti-tarnish process.  Can be used electrolytically and/or immersion.
DURAWEAR Chromate-free immersion anti-tarnish process.  Can be regenerated with replenisher chemistry.
CHEMPOL CB Blend of dry acid activating salts formulated to remove tenacious films and oxides from copper and copper alloys.
TINOX Antiquing process for gold deposits
NICKEL REDUCER FOR GOLD Precipitates nickel ions from acid gold plating solutions.
NICKEL REDUCER FOR RHODIUM Precipitates nickel ions from rhodium plating solutions.
ACTIUM I Non-cyanide nickel activator.
GOLD BUG CATHODE Cathodic target used to electrolytically remove gold ions from drag-outs.

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